TOP 3 Interconnect leaflets 2015
(Published 2015-12- by Theo Hooft)

With the year ending here is our TOP 3 list of 2015 interesting interconnect technologies based on leaflet requests: Our number 3: Miniature and micro RF compatible with I-pex, Hirose, SMK, Amphenol and others. Our number 2: Modular backplane cabling systems for 1.8 mm, 2.00 mm, 2,54 mm ( VME, CPCI and VPX). The top position is this year for goldwire elastomeric technology the innovative technology to create fine pitch board to board, flex to board interconnects with pitches far below 0,3 mm! Did you miss one of them? Go to the download area.

Embedded LoRa Technology?
(Published 2015-12- by Theo Hooft)

One of the new, very interesting developments around IoT is the emerging need for longer range, low power embedded wireless solutions, high network capacity solution. Recently Microchip introduced its LoRa technology RN248 (433/868 MHz) and the RN2903 (915 MHz)products to cover this segment. Key features: Long range greater than 15 km Low power consumption up to 10 years battery life High network capacity up to 1 million nodes If you plan to use the RN2483 or RN2903 module and you need a suitable micro RF connector, cable assembly or antenna then you know where to find us.

USB TYPE C performance ruggedized?
(Published 2015-10- by Theo Hooft)

To connect EFBs or other information devices and terminals its easy if one can make use of the USB standards. However when connecting subsystems there is a need for a rugged IO panel feed through capable of carrying USB 3.1 Type C signals and allow USB power delivery. The solution? Use Hercules size 13 or size 17 high speed connectors with USB pigtails. Check to download page for more details!

High Density, Controlled Impedance, IO
(Published 2015-10- by Theo Hooft)

Controlled Impedance IO connector? Rugged wire or panel applications? HERCULES HS-D High Speed D-Sub embedded in the rugged rectangular MIL-DTL-24308 shell provides both durable and high-bandwidth interconnect scheme suitable for Military, Aerospace and ruggedizedcommercial high-bandwidth applications not previously accommodated by Industry standard connectors.You can download the leaflet on the download page.

MIL-HIGH SPEED IO TO PCB
(Published 2015-09- by Theo Hooft)

It is not always possible or wise to use a rigid right angle board to board connector in box or other embedded applications. Sometimes you do not even want to have a rigid connection between panel, connector and pcb.Take a look at the attached 10 Gbps, 38999 shell solution for rugged applications. With high performance flex circuit made out of Dupont Pyralux material, Samtec board to board connectors and equipped with proven Hercules IO connector this assembly could be a perfect alternative! You can download the leaflet from the download section.

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